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Rigid Printed Wiring Boards - Production

Production Specifications (Mass Production in Thailand Factory)

Specifications Factory standards
1)Type Through
2)Number of layers Double-sided
3)Substrate FR-4
4)Substrate thickness 0.30mm-1.60mm

5) L/S
wiring width(L)/wiring spacing(S)

Surface Copper foil: 12 μm 75.0μm/87.5μm
Copper foil: 18 μm 100μm/100μm
6)Minimum via diameter/land diameter 0.30/0.55mm
7)Resist (color) Green
8)Silk (color) White
9)Plating Electrolytic soft gold plating
10)Outline machining Router