Business

Rigid Printed Wiring Boards - Production

Specifications			Factory standards
1)Type			Through
2)Number of layers			Double-sided
3)Substrate			FR-4
4)Substrate thickness			0.30mm-1.60mm
5) L/S wiring width（L)/wiring spacing（S)	Surface	Copper foil: 12 μm	75.0µm/75.0µm
5) L/S wiring width（L)/wiring spacing（S)	Surface	Copper foil: 18 μm	100μm/100μm
6)Minimum via diameter/land diameter			0.30/0.55mm
7)Resist (color)			Green
8)Silk (color)			White
9)Plating			Electrolytic soft gold plating
10)Outline machining			Router