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Flexible Printed Wiring Boards-Production

TABフレキ基板

1: We can support from mass production to many kinds of small quantity production
(We have both Reel To Reel Method and Sheet formed Production processes)

2: High density fine Flexible Printed Wiring Boards production

Reel-to reel method can produce TAB and COF of the high productivity by automation including feed and winding and of high quality by the non contact method that completely minimizes human intervention. And,we can meet to a wide range of customer’s requests by producing with sheet form.

TAB Flexible Board-Features and Structure

TAB is an abbreviation for Tape Automated Bonding, which is the name of an IC mounting method.

TAB:Tape Automated Bonding

A TAB flexible board

A TAB flexible board has a single-sided wiring structure. It bears connection holes, called contact holes, in the board that enable electrical connection from the back side.

Reel To Reel Method

We use the reel to reel method to manufacture various flexible printed wiring boards, offering services from prototype to mass production and mounting.

Features of Reel to Reel Method

  • The reel to reel method allows for mass production of flexible printed wiring boards.
  • All processing devices are installed in a clean room of class 1,000.
  • The cover lay method is used for surface protection of flexible printed wiring boards.
  • Electrolytic plating equipment for Ni (nickel) / Au (gold) are used, allowing us to provide products that meet the specification needs of customers.
  • An inner lead structure can be formed for connection contacts.
TAB Flexible boards
Clean room
Inner lead

Our Approach to Quality and Environment

  • Quality assurance is conducted for all products by automatic visual inspection and electric inspection.
  • A variety of analytical equipment are used to perform a quality check at each process and to measure amount and length.
  • We provide flexible printed wiring boards with fire retardancy that meets RoHS compliance and 94 VTM-0.

High-density fine Flexible Printed Wiring Boards (Development Products)

By adopting ultra-thin, ultra-thin, ultra-small flexible printed wiring boards, it contributes to miniaturization and thinning of modules.

High density lines (30 µm pitch or less)/VIA fill

Under development of 20 µm pitch f ine Flexible Printed Wiring boards

Schematic view

Cross sectional view

Cross sectional view

SEM picture

Circuit picture

Enlarged circuit picture

VIA filling part sectional picture

Printed Wiring boards - Mounting

We use our proprietary transfer technology (the reel to reel method) to mount flexible printed wiring boards, or use sheets to mount printed wiring boards (rigid / flexible), depending on the needs.

Printed Wiring boards - Mounting

Production Specifications of Flexible Printed Wiring Boards (Basic Specifications)

  subtractive (etching) Method MSAP (plating) Method
  【mass production】 【Under development】 【Under development】 【Under development】
structure TAB COF FPC / COF TAB
Single sided Single sided / Double sided
L/S(MIN) 35/40, 35/45µm 25/25µm 18/18µm 18/18µm
Base material thickness Ad: 12µm
PI: 50µm
25µm・38µm 25µm 25µm
Copper thickness (Circuit thickness) 25µm, 35µm 8µm・12µm 25µm 25µm
Circuit protection Cover lay Cover lay・Resist Photosensitivity Cover lay Photosensitivity Cover lay
Terminal surface treatment Electrolytic Ni Au Electrolytic Ni Au Direct Au・Others Direct Au・Others
Outer Dimension size【 mm 】 Min10×10
Max60×120
Min10×10
Max60×120
Min10×10
Max70×70
Min10×10
Max70×70
Outer Dimension accuracy ±0.2mm ±0.2mm ±0.1mm ±0.1mm
PT distance from the edge 0.8mm or more 0.8mm or more 0.1mm or more 0.1mm or more
Production Form R to R sheet
  • Above is the standard value. We can consider the specification more than this value.

We can support the production for mass volume by the Reel to Reel method and for many kinds of small quantity by the sheet formed production

Layer structure (Reference)

  Single side printed wiring boards Double sided printed wiring boards
Layer
structure
片面FPC 両面FPC
Layer
Specifications
A:Terminal treatment ※
B:Wiring protection layer ※
C:Wiring layer Copper foil and Copper plating
D:Interlaminar Insulating layer Polyimide
A:Terminal treatment ※
B:Wiring protection layer ※
C:Wiring layer Copper foil and Copper plating
D:Interlaminar Insulating layer Polyimide
E:Wiring layer Copper foil and Copper plating
F:Wiring protection layer ※
G:Terminal treatment ※
  • Please feel free to contact us about specification of layer structure and materials